个人简介

一、基本情况：

2017年10月毕业于南京航空航天大学机电学院，获工学博士学位。2017年11月-2018年8月任职于中科院合肥物质科学研究院先进制造技术研究所。2018年9月至今任教于苏州科技大学机械工程学院。2020年被遴选为硕士研究生导师。

二、主要研究领域及学术成就：

主要从事超声辅助/高效精密磨削加工技术研究。主持在研国家自然科学基金项目1项、江苏省自然科学基金项目1项、江苏省高校自然科学研究项目1项；主要参与完成国家科技重大专项、国家自然基金重点项目等各类研究项目多项。发表SCI检索论文十余篇，获授权发明专利1项。指导江苏省大学生创新训练重点项目（国家级）1项。指导本科学生为第一作者发表学术论文1篇。

三、代表性科研成果：

学术论文：

[1]Benkai LI^#, Chenwei DAI^#, Wenfeng DING, Changyong YANG, Changhe LI, Olga KULIK, Vyacheslav SHUMYACHER. Prediction on grinding force during grinding powder metallurgy nickel-based superalloy FGH96 with electroplated CBN abrasive wheel. Chinese Journal of Aeronautics, 2021. (SCI,已录用)

[2]Jiajia Chen, Yucan Fu, Ning Qian, Huafei Jiang, Chan Y. Ching, Dan Ewing,Chenwei Dai. Prediction on grinding force during grinding powder metallurgy nickel-based superalloy FGH96 with electroplated CBN abrasive wheel. AppliedThermal Engineering, 2021, 182: 116031.(SCI)

[3]Yin, Zhen;Dai, Chenwei*; Cao, Ziyang; Li, Wei; Chen, Zhenzhen; Li, Chuang. Modal analysis and moving performance of a single-mode linear ultrasonic motor. Ultrasonics, 2020, 108: 0-106216. (SCI)

[4]Min, Li; Wenfeng, Ding*; Zhengcai, Zhao;Chenwei, Dai**; Jiuhua, Xu. An investigation on the dressing contact behavior between vitrified bonded CBN abrasive wheel and diamond grit dresser. Journal of Manufacturing Processes, 2020, 58: 355-367.

[5]Chenwei Dai, Zhen Yin, Wenfeng Ding. Grinding force and energy modeling of textured monolayer CBN wheels considering undeformed chip thickness nonuniformity. International Journal of Mechanical Sciences, 2019, 157:221-230. (SCI)

[6]Chenwei Dai, Tianyu Yu, Wenfeng Ding, Jiuhua Xu, Zhen Yin, Hua Li. Single diamond grain cutting-edges morphology effect on grinding mechanism of Inconel 718. Precision Engineering, 2019, 55: 119-126. (SCI, 同时入选ESI高被引论文和热点论文)

[7]Chenwei Dai, Wenfeng Ding, Yejun Zhu, Jiuhua Xu, Haiwu Yu. Grinding temperature and power consumption in high speed grinding of Inconel 718 nickel-based superalloy with vitrified CBN wheels. Precision Engineering, 2018, 52: 192-200. (SCI)

[8]Chenwei Dai, Wenfeng Ding, Jiuhua Xu, Yucan Fu, Tianyu Yu. Influence of grain wear on material removal behavior during grinding nickel-based superalloy with single diamond grain. International Journal of Machine Tools & Manufacture, 2017, 113: 49-58. (SCI, 同时入选ESI高被引论文和热点论文)

[9]Wenfeng Ding,Chenwei Dai, Tianyu Yu, Jiuhua Xu, Yucan Fu. Grinding performance of textured monolayer CBN wheels: undeformed chip thickness nonuniformity modeling and ground surface topography prediction. International Journal of Machine Tools & Manufacture, 2017, 122: 66-80. (SCI, 同时入选ESI高被引论文和热点论文)

[10]Chenwei Dai, Wenfeng Ding, Jiuhua Xu, Xipeng Xu, Dengkui Fu. Effects of undeformed chip thickness on grinding temperature and burn-out in high-efficiency deep grinding of Inconel 718 superalloys. International Journal of Advanced Manufacturing Technology, 2017, 89: 1841-1852. (SCI)

[11]Chenwei Dai, Wenfeng Ding, Jiuhua Xu, Chen Ding, Guoqing Huang. Investigation on size effect of grain wear behavior during grinding nickel-based superalloy Inconel 718. International Journal of Advanced Manufacturing Technology, 2017, 91: 2907-2917. (SCI)

专利：

[1]一种磨粒位姿可控的单颗磨粒磨削试验平台及其试验方法. ZL201510532672.1, 发明专利, 授权, 第二发明人

四、代表性科研项目：

[1] 超声椭圆振动高效磨削SiC陶瓷的去除机理与损伤控制研究，国家自然科学基金，主持，2020.01-2022.12

[2]超声椭圆振动高效低损伤磨削SiC陶瓷的基础研究，江苏省自然科学基金，2020.01-2022.12

[3]基于磨粒切厚分布的SiC陶瓷超声椭圆振动高效低损伤磨削，江苏省高等学校自然科学研究面上项目，2020.01-2021.12